ChipR Trim™
LT3200 & LT4200 – Thick Film Chip Component Laser Trim System
High performance chip trim systems designed specifically for thick film components down to the latest 01005 products.
LT3210 & LT4210 – Thin Film Chip Component Laser Trim System
High performance chip trim systems designed specifically for thin film components down to the latest 01005 products.
Benefits
Yield control and throughput
- Absolute coordinates – minimizes beam “walking”
- Superior matching between multiple systems
- More throughput with fewer alignments
- Enables smaller pad sizes
Reduced setup time
- End user customization of trim algorithm
- Minimized program development time
- Insertion of user interface controls via plug in components
Technical Data
Beam Positioning |
High-speed closed loop galvanometer scanner |
XY Stage Resolution: | 1.0 μm |
XY Stage Travel: | 100 x 200 mm |
Stage: | X, Y, Z, W, Theta |
Spot size: | from 10 microns thin film to 30 microns thick film |
Part loading: | automated |
Options
- Spot size down to 10 microns
- Patented 532 nm diode-pumped laser technology for minimum maintenance, long term stability and high reliability
- Patented beam calibration and vision system for automatic alignment and precise laser positioning
- High speed handler manages thin substrates used with the latest generation small geometry chip resistors
- Wide range measurement system
- 5 milli-Ohms to 1 Gig Ohm
- Traceable measurement certification
Software
ChipTrim™ Software
- Graphical user environment dedicated to chip trimming
- Globalized language support
Exclusive license rights to the circuit trim product portfolio of Electro Scientific Industries, Inc. (ESI)
With the license agreement, the Photonics Systems Group, and with this L-TRIS, receives access to patents and know-how for the production, support and service of the ESI LT31XX & LT41XX systems. The goal of the agreement is to ensure worldwide service and support for ESI’s existing circuit trim customers and to further develop the product market for the companies of the group.