Laser-Applikationszentrum zur Bearbeitung von kristalline Solarzellen, keramische Komponenten, Leiterplattensubstrate und andere spröde Materialien wie Glas mit unterschiedlichen Anwendungen

Laser machines for micro material processing

Thanks to the modular platform concept, each of our laser systems can be individually configured for the respective production task and designed as a stand-alone machine or for inline integration. Worldwide service and support also support the smooth commissioning and reliable operation of our systems.


Launch of the future in laser trimming.

Sensor & Circuit Trim

Standard Circuit Trimming System

Wafer Trim™

Laser Systems for Wafer Trimming

Are you interested in our laser machines and their performance advantages?

No matter whether you would like to get basic advice or already have very precise ideas – we will be happy to help you!

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